型号 TMSDC6726BRFPA225
厂商 Texas Instruments
描述 IC FLOATING-POINT DSP 144-HTQFP
TMSDC6726BRFPA225 PDF
代理商 TMSDC6726BRFPA225
标准包装 60
系列 TMS320C672x
类型 浮点
接口 EBI/EMI,I²C,McASP,SPI
时钟速率 225MHz
非易失内存 ROM(384 kB)
芯片上RAM 288kB
电压 - 输入/输出 3.30V
电压 - 核心 1.20V
工作温度 -40°C ~ 105°C
安装类型 表面贴装
封装/外壳 144-TQFP 裸露焊盘
供应商设备封装 144-HTQFP(20x20)
包装 托盘
其它名称 296-34546-5
TMSDC6726BRFPA225-ND
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TMS-SCE-1/2-2.0-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1/4-2.0-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1/8-2.0-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/2-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/2-2.0-3 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/2-2.0-6 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/2-2.0-S1-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/2-2.0-S3-9 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-3 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-6 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/4-2.0-S1-4 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/4-2.0-S1-9 TE Connectivity HEAT SHRINK SLEEVE
TMS-SCE-1K-1/4-2.0-S3-9 TE Connectivity HEAT SHRINK SLEEVE MARKER
TMS-SCE-1K-1/8-2.0-0 TE Connectivity HEAT SHRINK SLEEVE MARKER